Publication:
"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects
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1989 since deposited on 2021-10-25
4last month
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Acq. date: 2026-01-08
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1989 since deposited on 2021-10-25
4last month
1last week
Acq. date: 2026-01-08
Citations