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"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects

dc.contributor.authorDe Vos, Joeri
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorJourdain, Anne
dc.contributor.authorHeylen, Nancy
dc.contributor.authorPeng, Lan
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorSardo, Stefano
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-25T17:51:14Z
dc.date.available2021-10-25T17:51:14Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30558
dc.sourceIIOimport
dc.title"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects
dc.typeProceedings paper
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorSardo, Stefano
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecSardo, Stefano::0000-0002-9302-8007
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1499
dc.source.endpage1504
dc.source.conferenceIEEE 68th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2018
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8429741
imec.availabilityPublished - imec


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