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First demonstration of monocrystalline silicon macaroni channel for 3-D NAND memory devices

dc.contributor.authorDelhougne, Romain
dc.contributor.authorArreghini, Antonio
dc.contributor.authorRosseel, Erik
dc.contributor.authorHikavyy, Andriy
dc.contributor.authorVecchio, Emma
dc.contributor.authorZhang, Liping
dc.contributor.authorPak, Murat
dc.contributor.authorNyns, Laura
dc.contributor.authorRaymaekers, Tom
dc.contributor.authorJossart, Nico
dc.contributor.authorBreuil, Laurent
dc.contributor.authorVadakupudhu Palayam, Senthil
dc.contributor.authorTan, ChiLim
dc.contributor.authorVan den Bosch, Geert
dc.contributor.authorFurnemont, Arnaud
dc.date.accessioned2021-10-25T18:00:11Z
dc.date.available2021-10-25T18:00:11Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30588
dc.sourceIIOimport
dc.titleFirst demonstration of monocrystalline silicon macaroni channel for 3-D NAND memory devices
dc.typeProceedings paper
dc.contributor.imecauthorDelhougne, Romain
dc.contributor.imecauthorArreghini, Antonio
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorVecchio, Emma
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorPak, Murat
dc.contributor.imecauthorNyns, Laura
dc.contributor.imecauthorJossart, Nico
dc.contributor.imecauthorBreuil, Laurent
dc.contributor.imecauthorVadakupudhu Palayam, Senthil
dc.contributor.imecauthorVan den Bosch, Geert
dc.contributor.imecauthorFurnemont, Arnaud
dc.contributor.orcidimecArreghini, Antonio::0000-0002-7493-9681
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecNyns, Laura::0000-0001-8220-870X
dc.contributor.orcidimecBreuil, Laurent::0000-0003-2869-1651
dc.contributor.orcidimecVan den Bosch, Geert::0000-0001-9971-6954
dc.contributor.orcidimecFurnemont, Arnaud::0000-0002-6378-1030
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage203
dc.source.endpage204
dc.source.conferenceIEEE Symposium on VLSI Technology
dc.source.conferencedate18/06/2018
dc.source.conferencelocationHonolulu, HI USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8510635
imec.availabilityPublished - open access


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