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Ultra-low warpage epoxy mold compound for fan-out wafer level package applications

dc.contributor.authorDuval, Fabrice
dc.contributor.authorPodpod, Arnita
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBertheau, Julien
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-25T18:23:16Z
dc.date.available2021-10-25T18:23:16Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30661
dc.sourceIIOimport
dc.titleUltra-low warpage epoxy mold compound for fan-out wafer level package applications
dc.typeProceedings paper
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conference6th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum - MiNaPAD Forum
dc.source.conferencedate16/05/2018
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttps://www.minalogic.com/sites/default/files/flyer_minapad_2018.pdf
imec.availabilityPublished - imec


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