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Real 3D depth profiling of heterogeneous microelectronic structures using a combined ToF-SIMS/in-situ SPM tool

dc.contributor.authorFranquet, Alexis
dc.contributor.authorSpampinato, Valentina
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorvan der Heide, Paul
dc.date.accessioned2021-10-25T18:46:40Z
dc.date.available2021-10-25T18:46:40Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30728
dc.sourceIIOimport
dc.titleReal 3D depth profiling of heterogeneous microelectronic structures using a combined ToF-SIMS/in-situ SPM tool
dc.typeOral presentation
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorSpampinato, Valentina
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorvan der Heide, Paul
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecSpampinato, Valentina::0000-0003-3225-6740
dc.contributor.orcidimecvan der Heide, Paul::0000-0001-6292-0329
dc.source.peerreviewno
dc.source.conferenceSIMS Europe 2018
dc.source.conferencedate16/09/2018
dc.source.conferencelocationMünster Germany
imec.availabilityPublished - imec


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