Show simple item record

TCB optimization for stacking large thinned dies with 40 and 20μm pitch microbumps

dc.contributor.authorGerets, Carine
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBex, Pieter
dc.contributor.authorLofrano, Melina
dc.contributor.authorCherman, Vladimir
dc.contributor.authorCochet, Tom
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-25T19:00:02Z
dc.date.available2021-10-25T19:00:02Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30763
dc.sourceIIOimport
dc.titleTCB optimization for stacking large thinned dies with 40 and 20μm pitch microbumps
dc.typeProceedings paper
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage6
dc.source.conference7th Electronic System-Integration Technology Conference - ESTC
dc.source.conferencedate18/09/2018
dc.source.conferencelocationDresden Germany
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8546425
imec.availabilityPublished - imec


Files in this item

Thumbnail
Name:
39197.pdf
Size:
719.7Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record