TCB optimization for stacking large thinned dies with 40 and 20μm pitch microbumps

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Authors
Gerets, Carine; Derakhshandeh, Jaber; Bex, Pieter; Lofrano, Melina; Cherman, Vladimir; Cochet, Tom; Rebibis, Kenneth June; Beyer, Gerald; Miller, Andy; Beyne, Eric
Conference
7th Electronic System-Integration Technology Conference - ESTC
Title
TCB optimization for stacking large thinned dies with 40 and 20μm pitch microbumps
Publication type
Proceedings paper
Embargo date
9999-12-31
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