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Conference contributions
TCB optimization for stacking large thinned dies with 40 and 20μm pitch microbumps
Publication:
TCB optimization for stacking large thinned dies with 40 and 20μm pitch microbumps
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Date
2018
Proceedings Paper
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Gerets, Carine
;
Derakhshandeh, Jaber
;
Bex, Pieter
;
Lofrano, Melina
;
Cherman, Vladimir
;
Cochet, Tom
;
Rebibis, Kenneth June
;
Beyer, Gerald
;
Miller, Andy
;
Beyne, Eric
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1956
since deposited on 2021-10-25
Acq. date: 2025-12-15
Citations
Metrics
Views
1956
since deposited on 2021-10-25
Acq. date: 2025-12-15
Citations