Publication:

TCB optimization for stacking large thinned dies with 40 and 20μm pitch microbumps

Date

2018
Proceedings Paper
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dc.contributor.authorGerets, Carine
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBex, Pieter
dc.contributor.authorLofrano, Melina
dc.contributor.authorCherman, Vladimir
dc.contributor.authorCochet, Tom
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.accessioned2021-10-25T19:00:02Z
dc.date.available2021-10-25T19:00:02Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30763
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8546425
dc.source.beginpage1
dc.source.conference7th Electronic System-Integration Technology Conference - ESTC
dc.source.conferencedate18/09/2018
dc.source.conferencelocationDresden Germany
dc.source.endpage6
dc.title

TCB optimization for stacking large thinned dies with 40 and 20μm pitch microbumps

dc.typeProceedings paper
dspace.entity.typePublication
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