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Contactless fault isolation of ultra low k dielectrics in soft breakdown condition

dc.contributor.authorHerfurth, Norbert
dc.contributor.authorWu, Chen
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.contributor.authorBoit, Christian
dc.date.accessioned2021-10-25T19:43:36Z
dc.date.available2021-10-25T19:43:36Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30876
dc.sourceIIOimport
dc.titleContactless fault isolation of ultra low k dielectrics in soft breakdown condition
dc.typeProceedings paper
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conferenceInternational Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA
dc.source.conferencedate16/07/2018
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8452487
imec.availabilityPublished - open access


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