Authors

Hiblot, Gaspard; Van Huylenbroeck, Stefaan; Van der Plas, Geert; De Wachter, Bart; Vaisman Chasin, Adrian; Kaczer, Ben; Chiarella, Thomas; Mitard, Jerome; Demuynck, Steven; Beyer, Gerald; Beyne, Eric

Conference

IEEE Electron Devices Technology and Manufacturing Conference - EDTM

Title

Impact of 1 $lm TSV via-last integration on electrical performance of advanced FinFET devices

Publication type

Proceedings paper

Embargo date

9999-12-31