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Impact of 1 $lm TSV via-last integration on electrical performance of advanced FinFET devices

dc.contributor.authorHiblot, Gaspard
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wachter, Bart
dc.contributor.authorVaisman Chasin, Adrian
dc.contributor.authorKaczer, Ben
dc.contributor.authorChiarella, Thomas
dc.contributor.authorMitard, Jerome
dc.contributor.authorDemuynck, Steven
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-25T19:51:24Z
dc.date.available2021-10-25T19:51:24Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30895
dc.sourceIIOimport
dc.titleImpact of 1 $lm TSV via-last integration on electrical performance of advanced FinFET devices
dc.typeProceedings paper
dc.contributor.imecauthorHiblot, Gaspard
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wachter, Bart
dc.contributor.imecauthorVaisman Chasin, Adrian
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorChiarella, Thomas
dc.contributor.imecauthorMitard, Jerome
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecHiblot, Gaspard::0000-0002-3869-965X
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVaisman Chasin, Adrian::0000-0002-9940-0260
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.contributor.orcidimecChiarella, Thomas::0000-0002-6155-9030
dc.contributor.orcidimecMitard, Jerome::0000-0002-7422-079X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage122
dc.source.endpage124
dc.source.conferenceIEEE Electron Devices Technology and Manufacturing Conference - EDTM
dc.source.conferencedate13/03/2018
dc.source.conferencelocationKobe Japan
imec.availabilityPublished - open access


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