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A fully 3-D BIE evaluation of the resistance and inductance of on-board and on-chip interconnects
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A fully 3-D BIE evaluation of the resistance and inductance of on-board and on-chip interconnects
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Date
2018
Proceedings Paper
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40908.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Huynen, Martijn
;
De Zutter, Daniel
;
Vande Ginste, Dries
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Abstract
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1863
since deposited on 2021-10-25
Acq. date: 2026-01-07
Citations
Metrics
Views
1863
since deposited on 2021-10-25
Acq. date: 2026-01-07
Citations