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A fully 3-D BIE evaluation of the resistance and inductance of on-board and on-chip interconnects
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Authors
Huynen, Martijn
;
De Zutter, Daniel
;
Vande Ginste, Dries
Conference
IEEE 22nd Workshop on Signal and Power Integrity - SPI2018
Title
A fully 3-D BIE evaluation of the resistance and inductance of on-board and on-chip interconnects
Publication type
Proceedings paper
Embargo date
9999-12-31
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