| dc.contributor.author | Huynen, Martijn | |
| dc.contributor.author | De Zutter, Daniel | |
| dc.contributor.author | Vande Ginste, Dries | |
| dc.date.accessioned | 2021-10-25T20:07:29Z | |
| dc.date.available | 2021-10-25T20:07:29Z | |
| dc.date.issued | 2018 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/30932 | |
| dc.source | IIOimport | |
| dc.title | A fully 3-D BIE evaluation of the resistance and inductance of on-board and on-chip interconnects | |
| dc.type | Proceedings paper | |
| dc.contributor.imecauthor | Huynen, Martijn | |
| dc.contributor.imecauthor | De Zutter, Daniel | |
| dc.contributor.imecauthor | Vande Ginste, Dries | |
| dc.contributor.orcidimec | Huynen, Martijn::0000-0002-5168-9421 | |
| dc.contributor.orcidimec | Vande Ginste, Dries::0000-0002-0178-288X | |
| dc.date.embargo | 9999-12-31 | |
| dc.source.peerreview | yes | |
| dc.source.beginpage | 1 | |
| dc.source.endpage | 4 | |
| dc.source.conference | IEEE 22nd Workshop on Signal and Power Integrity - SPI2018 | |
| dc.source.conferencedate | 22/05/2018 | |
| dc.source.conferencelocation | Brest France | |
| dc.identifier.url | https://ieeexplore.ieee.org/document/8401653 | |
| imec.availability | Published - open access | |
| imec.internalnotes | ISBN 978-1-5386-2299-5 | |
