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Polymer and bump planarization for fine pitch micro-bump stacking

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorMoeller, Berthold
dc.contributor.authorGokita, Yohei
dc.contributor.authorDuval, Fabrice
dc.contributor.authorBex, Pieter
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-25T20:09:41Z
dc.date.available2021-10-25T20:09:41Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30937
dc.sourceIIOimport
dc.titlePolymer and bump planarization for fine pitch micro-bump stacking
dc.typeMeeting abstract
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1135
dc.source.conferenceAiMES2018 Meeting G05-Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density ...
dc.source.conferencedate30/09/2018
dc.source.conferencelocationCancun Mexico
dc.identifier.urlhttp://ma.ecsdl.org/content/MA2018-02/33/1135.abstract
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts; Vol. MA2018-02


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