Authors
Inoue, Fumihiro;
Derakhshandeh, Jaber;
Moeller, Berthold;
Gokita, Yohei;
Duval, Fabrice;
Bex, Pieter;
Capuz, Giovanni;
Rebibis, Kenneth June;
Miller, Andy;
Sleeckx, Erik;
Beyer, Gerald;
Beyne, Eric
Conference
AiMES2018 Meeting G05-Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density ...
Title
Polymer and bump planarization for fine pitch micro-bump stacking
Publication type
Meeting abstract
