Publication:

Polymer and bump planarization for fine pitch micro-bump stacking

Date

2018
Meeting abstract
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dc.contributor.authorInoue, Fumihiro
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorMoeller, Berthold
dc.contributor.authorGokita, Yohei
dc.contributor.authorDuval, Fabrice
dc.contributor.authorBex, Pieter
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-25T20:09:41Z
dc.date.available2021-10-25T20:09:41Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30937
dc.identifier.urlhttp://ma.ecsdl.org/content/MA2018-02/33/1135.abstract
dc.source.beginpage1135
dc.source.conferenceAiMES2018 Meeting G05-Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density ...
dc.source.conferencedate30/09/2018
dc.source.conferencelocationCancun Mexico
dc.title

Polymer and bump planarization for fine pitch micro-bump stacking

dc.typeMeeting abstract
dspace.entity.typePublication
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