Influence of composition of SiCN for surface activated bonding

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Authors
Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Visker, Jakob; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyne, Eric
Conference
Semiconductor Wafer Bonding: Science, Technology, and Applications 15
Title
Influence of composition of SiCN for surface activated bonding
Publication type
Proceedings paper
Embargo date
9999-12-31
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