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Cu resistivity and intrinsic EM-reliability study in Ta/Cu, Co/Cu and Ru/Cu systems for advanced BEOL Cu interconnections

dc.contributor.authorJourdan, Nicolas
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorAdelmann, Christoph
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-25T20:29:33Z
dc.date.available2021-10-25T20:29:33Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30982
dc.sourceIIOimport
dc.titleCu resistivity and intrinsic EM-reliability study in Ta/Cu, Co/Cu and Ru/Cu systems for advanced BEOL Cu interconnections
dc.typeProceedings paper
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage469
dc.source.endpage470
dc.source.conference50th International Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate9/09/2018
dc.source.conferencelocationTokyo Japan
dc.identifier.urlhttp://www.ssdm.jp/SSDM2018_TechnicalProgram-All_Sep11-13.pdf?d=20180824
imec.availabilityPublished - open access


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