Authors

Li, Yunlong; Van Huylenbroeck, Stefaan; De Vos, Joeri; Wu, Chen; Stucchi, Michele; Croes, Kristof; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric

Conference

Advanced Metallization Conference 2018, 28th Asian session (ADMETAPlus 2018)

Title

Dielectric reliability of highly scaled through silicon via for wafer level 3D-SoC applications

Publication type

Meeting abstract