dc.contributor.author | Liu, Yong | |
dc.contributor.author | Derakhshandeh, Jaber | |
dc.contributor.author | Gao, Yao | |
dc.contributor.author | Rebibis, Kenneth June | |
dc.contributor.author | De Wolf, Ingrid | |
dc.contributor.author | Li, Pei | |
dc.date.accessioned | 2021-10-25T22:19:25Z | |
dc.date.available | 2021-10-25T22:19:25Z | |
dc.date.issued | 2018 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/31213 | |
dc.source | IIOimport | |
dc.title | Study on 3D self-aligned assembly using chips with etched edge and SAM for liquid | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Derakhshandeh, Jaber | |
dc.contributor.imecauthor | Rebibis, Kenneth June | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1 | |
dc.source.endpage | 4 | |
dc.source.conference | International Conference on Electronics Packaging and iMAPS - ICEP-IAAC | |
dc.source.conferencedate | 17/04/2018 | |
dc.source.conferencelocation | Mie Japan | |
dc.identifier.url | https://ieeexplore.ieee.org/document/8374304 | |
imec.availability | Published - open access | |