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Study on 3D self-aligned assembly using chips with etched edge and SAM for liquid

dc.contributor.authorLiu, Yong
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorGao, Yao
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorLi, Pei
dc.date.accessioned2021-10-25T22:19:25Z
dc.date.available2021-10-25T22:19:25Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31213
dc.sourceIIOimport
dc.titleStudy on 3D self-aligned assembly using chips with etched edge and SAM for liquid
dc.typeProceedings paper
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceInternational Conference on Electronics Packaging and iMAPS - ICEP-IAAC
dc.source.conferencedate17/04/2018
dc.source.conferencelocationMie Japan
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8374304
imec.availabilityPublished - open access


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