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Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
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Authors
Mangal, Nivesh
;
Missinne, Jeroen
;
Roelkens, Gunther
;
Van Campenhout, Joris
;
Van Steenberge, Geert
;
Snyder, Brad
Conference
Optical Fiber Communication Conference and Exhibition - OFC
Title
Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
Publication type
Proceedings paper
Embargo date
9999-12-31
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