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Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics

dc.contributor.authorMangal, Nivesh
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorVan Steenberge, Geert
dc.contributor.authorSnyder, Brad
dc.date.accessioned2021-10-25T22:53:11Z
dc.date.available2021-10-25T22:53:11Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31277
dc.sourceIIOimport
dc.titleExpanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
dc.typeProceedings paper
dc.contributor.imecauthorMangal, Nivesh
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpageTu2A.1
dc.source.conferenceOptical Fiber Communication Conference and Exhibition - OFC
dc.source.conferencedate11/03/2018
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8385874
imec.availabilityPublished - open access


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