Integration of ball lens in through-package via to enable photonic chip-to-board coupling

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Authors
Mangal, Nivesh; Missinne, Jeroen; Van Campenhout, Joris; Van Steenberge, Geert; Snyder, Brad
Conference
IEEE Electronic Components and Technology Conference - ECTC
Title
Integration of ball lens in through-package via to enable photonic chip-to-board coupling
Publication type
Proceedings paper
Embargo date
9999-12-31
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