Show simple item record

Integration of ball lens in through-package via to enable photonic chip-to-board coupling

dc.contributor.authorMangal, Nivesh
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorVan Steenberge, Geert
dc.contributor.authorSnyder, Brad
dc.date.accessioned2021-10-25T22:53:42Z
dc.date.available2021-10-25T22:53:42Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31278
dc.sourceIIOimport
dc.titleIntegration of ball lens in through-package via to enable photonic chip-to-board coupling
dc.typeProceedings paper
dc.contributor.imecauthorMangal, Nivesh
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1140
dc.source.endpage1145
dc.source.conferenceIEEE Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2018
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8429688/
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
38429.pdf
Size:
1.044Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record