dc.contributor.author | Nivelle, Philippe | |
dc.contributor.author | Borgers, Tom | |
dc.contributor.author | Voroshazi, Eszter | |
dc.contributor.author | Poortmans, Jef | |
dc.contributor.author | D'Haen, Jan | |
dc.contributor.author | De Ceuninck, Ward | |
dc.contributor.author | Daenen, Michaël | |
dc.date.accessioned | 2021-10-26T00:13:16Z | |
dc.date.available | 2021-10-26T00:13:16Z | |
dc.date.issued | 2018 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/31426 | |
dc.source | IIOimport | |
dc.title | Mechanical and chemical adhesion at the encapsulant interfaces during the lamination of photovoltaic modules | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Nivelle, Philippe | |
dc.contributor.imecauthor | Borgers, Tom | |
dc.contributor.imecauthor | Voroshazi, Eszter | |
dc.contributor.imecauthor | Poortmans, Jef | |
dc.contributor.imecauthor | D'Haen, Jan | |
dc.contributor.imecauthor | De Ceuninck, Ward | |
dc.contributor.imecauthor | Daenen, Michaël | |
dc.contributor.orcidimec | Borgers, Tom::0000-0002-7878-6977 | |
dc.contributor.orcidimec | Poortmans, Jef::0000-0003-2077-2545 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 6C.4-1 | |
dc.source.endpage | 6C.4-6 | |
dc.source.conference | IEEE International Reliability Physics Symposium - IRPS | |
dc.source.conferencedate | 11/03/2018 | |
dc.source.conferencelocation | Burlingame, CA USA | |
dc.identifier.url | https://ieeexplore.ieee.org/document/8353630/ | |
imec.availability | Published - open access | |