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Mechanical and chemical adhesion at the encapsulant interfaces during the lamination of photovoltaic modules

dc.contributor.authorNivelle, Philippe
dc.contributor.authorBorgers, Tom
dc.contributor.authorVoroshazi, Eszter
dc.contributor.authorPoortmans, Jef
dc.contributor.authorD'Haen, Jan
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorDaenen, Michaël
dc.date.accessioned2021-10-26T00:13:16Z
dc.date.available2021-10-26T00:13:16Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31426
dc.sourceIIOimport
dc.titleMechanical and chemical adhesion at the encapsulant interfaces during the lamination of photovoltaic modules
dc.typeProceedings paper
dc.contributor.imecauthorNivelle, Philippe
dc.contributor.imecauthorBorgers, Tom
dc.contributor.imecauthorVoroshazi, Eszter
dc.contributor.imecauthorPoortmans, Jef
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorDaenen, Michaël
dc.contributor.orcidimecBorgers, Tom::0000-0002-7878-6977
dc.contributor.orcidimecPoortmans, Jef::0000-0003-2077-2545
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage6C.4-1
dc.source.endpage6C.4-6
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate11/03/2018
dc.source.conferencelocationBurlingame, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8353630/
imec.availabilityPublished - open access


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