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Stress induced densification of thin porous low-k films during nanoindentation

dc.contributor.authorOkudur, Oguzhan Orkut
dc.contributor.authorRedzheb, Murad
dc.contributor.authorVanstreels, Kris
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorGonzalez, Mario
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-26T00:23:55Z
dc.date.available2021-10-26T00:23:55Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31445
dc.sourceIIOimport
dc.titleStress induced densification of thin porous low-k films during nanoindentation
dc.typeProceedings paper
dc.contributor.imecauthorOkudur, Oguzhan Orkut
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOkudur, Oguzhan Orkut::0000-0002-4790-7772
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage118
dc.source.endpage120
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2018
dc.source.conferencelocationSanta Clara, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8430466/
imec.availabilityPublished - open access


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