Show simple item record

Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology

dc.contributor.authorPeng, Lan
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorIacovo, Serena
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorSleeckx, Erik
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorZinner, Dominik
dc.contributor.authorThomas, Wagenleitner
dc.contributor.authorThomas, Uhrmann
dc.contributor.authorMarkus, Wimplinger
dc.contributor.authorBen, Schoenaers
dc.contributor.authorAndre, Stesmans
dc.contributor.authorAfanasiev, Valeri
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-26T00:59:17Z
dc.date.available2021-10-26T00:59:17Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31505
dc.sourceIIOimport
dc.titleAdvances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
dc.typeProceedings paper
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorAfanasiev, Valeri
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage985
dc.source.endpage992
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2018
dc.source.conferencelocationSanta Clara, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8429664
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
38153.pdf
Size:
831.7Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record