dc.contributor.author | Podpod, Arnita | |
dc.contributor.author | Velenis, Dimitrios | |
dc.contributor.author | Phommahaxay, Alain | |
dc.contributor.author | Bex, Pieter | |
dc.contributor.author | Fodor, Ferenc | |
dc.contributor.author | Marinissen, Erik Jan | |
dc.contributor.author | Rebibis, Kenneth June | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-26T01:24:58Z | |
dc.date.available | 2021-10-26T01:24:58Z | |
dc.date.issued | 2018 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/31549 | |
dc.source | IIOimport | |
dc.title | High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Podpod, Arnita | |
dc.contributor.imecauthor | Velenis, Dimitrios | |
dc.contributor.imecauthor | Phommahaxay, Alain | |
dc.contributor.imecauthor | Bex, Pieter | |
dc.contributor.imecauthor | Fodor, Ferenc | |
dc.contributor.imecauthor | Marinissen, Erik Jan | |
dc.contributor.imecauthor | Rebibis, Kenneth June | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1 | |
dc.source.endpage | 5 | |
dc.source.conference | 16th Annual International Wafel Level Packaging Conference - iWLPC | |
dc.source.conferencedate | 23/10/2018 | |
dc.source.conferencelocation | San Jose, CA USA | |
dc.identifier.url | https://ieeexplore.ieee.org/document/8573262 | |
imec.availability | Published - imec | |