Show simple item record

dc.contributor.authorPodpod, Arnita
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBex, Pieter
dc.contributor.authorFodor, Ferenc
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-26T01:24:58Z
dc.date.available2021-10-26T01:24:58Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31549
dc.sourceIIOimport
dc.titleHigh density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package
dc.typeProceedings paper
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorFodor, Ferenc
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conference16th Annual International Wafel Level Packaging Conference - iWLPC
dc.source.conferencedate23/10/2018
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8573262
imec.availabilityPublished - imec


Files in this item

Thumbnail

This item appears in the following collection(s)

Show simple item record