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New adhesives for high density flip-chip interconnections

dc.contributor.authorWojciechowski, Dominique
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorReese, E.
dc.contributor.authorHagedorn, H.
dc.date.accessioned2021-10-01T09:49:39Z
dc.date.available2021-10-01T09:49:39Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3160
dc.sourceIIOimport
dc.titleNew adhesives for high density flip-chip interconnections
dc.typeProceedings paper
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage224
dc.source.endpage229
dc.source.conferenceProceedings IMAPS International Symposium on Microelectronics
dc.source.conferencedate1/11/1998
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


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