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dc.contributor.authorSuh, Hyo Seon
dc.contributor.authorNair, Vineet Vijayakrishnan
dc.contributor.authorRincon Delgadillo, Paulina
dc.contributor.authorDoise, Jan
dc.contributor.authorLorusso, Gian
dc.contributor.authorNealey, Paul
dc.contributor.authorMonreal, Victor
dc.contributor.authorBaskaran, Durairaj
dc.contributor.authorCao, Yi
dc.contributor.authorPadmanaban, Munirathna
dc.contributor.authorLi, Jin
dc.contributor.authorKato, Takeshi
dc.contributor.authorSutani, Takumichi
dc.contributor.authorIshimoto, Toru
dc.contributor.authorIkota, Masami
dc.contributor.authorKoshihara, Shunsuke
dc.date.accessioned2021-10-26T04:58:12Z
dc.date.available2021-10-26T04:58:12Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31881
dc.sourceIIOimport
dc.titleImpact of annealing temperature on DSA process: toward faster assembly kinetics
dc.typeProceedings paper
dc.contributor.imecauthorSuh, Hyo Seon
dc.contributor.imecauthorNair, Vineet Vijayakrishnan
dc.contributor.imecauthorRincon Delgadillo, Paulina
dc.contributor.imecauthorDoise, Jan
dc.contributor.imecauthorLorusso, Gian
dc.contributor.orcidimecNair, Vineet Vijayakrishnan::0000-0002-8970-2425
dc.source.peerreviewyes
dc.source.beginpage105860T
dc.source.conferenceAdvances in Patterning Materials and Processes XXXV
dc.source.conferencedate24/02/2018
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttps://doi.org/10.1117/12.2299496
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 10586


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