dc.contributor.author | Van Huylenbroeck, Stefaan | |
dc.contributor.author | Li, Yunlong | |
dc.contributor.author | De Vos, Joeri | |
dc.contributor.author | Jamieson, Geraldine | |
dc.contributor.author | Tutunjyan, Nina | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-26T07:04:10Z | |
dc.date.available | 2021-10-26T07:04:10Z | |
dc.date.issued | 2018 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/32070 | |
dc.source | IIOimport | |
dc.title | A highly reliable 1×5μm via-last TSV module | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Van Huylenbroeck, Stefaan | |
dc.contributor.imecauthor | Li, Yunlong | |
dc.contributor.imecauthor | De Vos, Joeri | |
dc.contributor.imecauthor | Jamieson, Geraldine | |
dc.contributor.imecauthor | Tutunjyan, Nina | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Van Huylenbroeck, Stefaan::0000-0001-9978-3575 | |
dc.contributor.orcidimec | Li, Yunlong::0000-0003-4791-4013 | |
dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
dc.contributor.orcidimec | Jamieson, Geraldine::0000-0002-6750-097X | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 94 | |
dc.source.endpage | 96 | |
dc.source.conference | IEEE International Interconnect Technology Conference - IITC | |
dc.source.conferencedate | 4/06/2018 | |
dc.source.conferencelocation | Santa Clara, CA USA | |
dc.identifier.url | https://ieeexplore.ieee.org/document/8430389/ | |
imec.availability | Published - imec | |