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A highly reliable 1×5μm via-last TSV module

dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorLi, Yunlong
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-26T07:04:10Z
dc.date.available2021-10-26T07:04:10Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32070
dc.sourceIIOimport
dc.titleA highly reliable 1×5μm via-last TSV module
dc.typeProceedings paper
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage94
dc.source.endpage96
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2018
dc.source.conferencelocationSanta Clara, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8430389/
imec.availabilityPublished - imec


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