Publication:

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling

Date

2018
Proceedings Paper
Simple item page Full metadata Statistics
Loading...
Thumbnail Image

Files

38576.pdf 2.53 MB

Author(s)

Vandooren, Anne  
;
Witters, Liesbeth  
;
Franco, Jacopo  
;
Mallik, Arindam  
;
Parvais, Bertrand  
;
Wu, Z.
;
Walke, Amey  
;
Deshpande, Paru  
;
Rosseel, Erik  
;
Hikavyy, Andriy  
;
Li, Waikin  
;
Peng, L.
;
Rassoul, Nouredine  
;
Jamieson, Geraldine  
;
Inoue, Fumihiro  
;
Verbinnen, Greet  
;
Devriendt, Katia  
;
Teugels, Lieve  
;
Heylen, Nancy  
;
Vecchio, Emma  
;
Zheng, T.
;
Waldron, Niamh  
;
De Heyn, Vincent  
;
Mocuta, Dan
;
Collaert, Nadine  

Journal

Abstract

Description

Statistics

Downloads

1 since deposited on 2021-10-26
Acq. date: 2026-02-05

Views

2008 since deposited on 2021-10-26
1last month
Acq. date: 2026-02-05

Citations

Statistics

Downloads

1 since deposited on 2021-10-26
Acq. date: 2026-02-05

Views

2008 since deposited on 2021-10-26
1last month
Acq. date: 2026-02-05

Citations