Authors

Vandooren, Anne; Witters, Liesbeth; Franco, Jacopo; Mallik, Arindam; Parvais, Bertrand; Wu, Z.; Walke, Amey; Deshpande, Paru; Rosseel, Erik; Hikavyy, Andriy; Li, Waikin; Peng, L.; Rassoul, Nouredine; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine

Conference

International Conference on IC Design and Technology - ICICDT

Title

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling

Publication type

Proceedings paper

Embargo date

9999-12-31