Key challenges and opportunities for 3D sequential integration

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Authors
Vandooren, Anne; Witters, Liesbeth; Franco, Jacopo; Mallik, Arindam; Parvais, Bertrand; Wu, Zhicheng; Li, Waikin; Rosseel, Erik; Hikavyy, Andriy; Peng, Lan; Rassoul, Nouredine; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Waldron, Niamh; Boemmels, Juergen; De Heyn, Vincent; Mocuta, Dan; Ryckaert, Julien; Collaert, Nadine
Conference
2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
Title
Key challenges and opportunities for 3D sequential integration
Publication type
Proceedings paper
Embargo date
9999-12-31
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