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Key challenges and opportunities for 3D sequential integration

dc.contributor.authorVandooren, Anne
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorFranco, Jacopo
dc.contributor.authorMallik, Arindam
dc.contributor.authorParvais, Bertrand
dc.contributor.authorWu, Zhicheng
dc.contributor.authorLi, Waikin
dc.contributor.authorRosseel, Erik
dc.contributor.authorHikavyy, Andriy
dc.contributor.authorPeng, Lan
dc.contributor.authorRassoul, Nouredine
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorDevriendt, Katia
dc.contributor.authorTeugels, Lieve
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVecchio, Emma
dc.contributor.authorTao, Zheng
dc.contributor.authorWaldron, Niamh
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorDe Heyn, Vincent
dc.contributor.authorMocuta, Dan
dc.contributor.authorRyckaert, Julien
dc.contributor.authorCollaert, Nadine
dc.date.accessioned2021-10-26T07:54:13Z
dc.date.available2021-10-26T07:54:13Z
dc.date.issued2018-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32141
dc.sourceIIOimport
dc.titleKey challenges and opportunities for 3D sequential integration
dc.typeProceedings paper
dc.contributor.imecauthorVandooren, Anne
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorMallik, Arindam
dc.contributor.imecauthorParvais, Bertrand
dc.contributor.imecauthorWu, Zhicheng
dc.contributor.imecauthorLi, Waikin
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorRassoul, Nouredine
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVecchio, Emma
dc.contributor.imecauthorTao, Zheng
dc.contributor.imecauthorWaldron, Niamh
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorDe Heyn, Vincent
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecMallik, Arindam::0000-0002-0742-9366
dc.contributor.orcidimecParvais, Bertrand::0000-0003-0769-7069
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecRassoul, Nouredine::0000-0001-9489-3396
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conference2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
dc.source.conferencedate15/10/2018
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8640203
imec.availabilityPublished - open access


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