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Bare wafer analysis for wet cleaning efficiency – The impact of classification and sensitivity

dc.contributor.authorWendt, Kay
dc.contributor.authorWilbers, Fabian
dc.contributor.authorRuth, Jochen
dc.contributor.authorLorant, Christophe
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorNewby, John
dc.contributor.authorBast, Gerhard
dc.contributor.authorSundar, Vignesh
dc.date.accessioned2021-10-26T09:19:23Z
dc.date.available2021-10-26T09:19:23Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32259
dc.sourceIIOimport
dc.titleBare wafer analysis for wet cleaning efficiency – The impact of classification and sensitivity
dc.typeProceedings paper
dc.contributor.imecauthorRuth, Jochen
dc.contributor.imecauthorLorant, Christophe
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorBast, Gerhard
dc.contributor.orcidimecLorant, Christophe::0000-0001-7363-9348
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage3
dc.source.conference29th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC
dc.source.conferencedate30/04/2018
dc.source.conferencelocationSaratoga Springs, NY USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8373202
imec.availabilityPublished - imec


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