dc.contributor.author | Celano, Umberto | |
dc.contributor.author | Hantschel, Thomas | |
dc.contributor.author | Boehme, Thijs | |
dc.contributor.author | Kanniainen, A. | |
dc.contributor.author | Wouters, Lennaert | |
dc.contributor.author | Bender, Hugo | |
dc.contributor.author | Bosman, Niels | |
dc.contributor.author | Drijbooms, Chris | |
dc.contributor.author | Folkersma, Steven | |
dc.contributor.author | Paredis, Kristof | |
dc.contributor.author | Vandervorst, Wilfried | |
dc.contributor.author | van der Heide, Paul | |
dc.date.accessioned | 2021-10-27T07:54:18Z | |
dc.date.available | 2021-10-27T07:54:18Z | |
dc.date.issued | 2019 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/32667 | |
dc.source | IIOimport | |
dc.title | Reverse tip sample scanning for precise and high-throughput electrical characterization of advanced nodes | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Celano, Umberto | |
dc.contributor.imecauthor | Hantschel, Thomas | |
dc.contributor.imecauthor | Boehme, Thijs | |
dc.contributor.imecauthor | Wouters, Lennaert | |
dc.contributor.imecauthor | Bender, Hugo | |
dc.contributor.imecauthor | Drijbooms, Chris | |
dc.contributor.imecauthor | Folkersma, Steven | |
dc.contributor.imecauthor | Paredis, Kristof | |
dc.contributor.imecauthor | Vandervorst, Wilfried | |
dc.contributor.imecauthor | van der Heide, Paul | |
dc.contributor.orcidimec | Celano, Umberto::0000-0002-2856-3847 | |
dc.contributor.orcidimec | Hantschel, Thomas::0000-0001-9476-4084 | |
dc.contributor.orcidimec | Wouters, Lennaert::0000-0002-6730-9542 | |
dc.contributor.orcidimec | Paredis, Kristof::0000-0002-5163-4164 | |
dc.contributor.orcidimec | van der Heide, Paul::0000-0001-6292-0329 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 90 | |
dc.source.endpage | 93 | |
dc.source.conference | IEEE International Electron Devices Meeting - IEDM 2019 | |
dc.source.conferencedate | 7/12/2019 | |
dc.source.conferencelocation | San Francisco, CA USA | |
imec.availability | Published - open access | |