Show simple item record

Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVervoort, Iwan
dc.contributor.authorJudelewicz, Moshe
dc.contributor.authorBender, Hugo
dc.contributor.authorConard, Thierry
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorBeyer, Gerald
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorPalmans, Roger
dc.contributor.authorLagrange, Sébastien
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-06T10:46:25Z
dc.date.available2021-10-06T10:46:25Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3280
dc.sourceIIOimport
dc.titleNon-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper
dc.typeProceedings paper
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.source.peerreviewno
dc.source.beginpage290
dc.source.endpage292
dc.source.conferenceProceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA.
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record