dc.contributor.author | De Messemaeker, Joke | |
dc.contributor.author | Jourdan, Nicolas | |
dc.contributor.author | Nolmans, Philip | |
dc.contributor.author | Kim, Soon-Wook | |
dc.contributor.author | Beyer, Gerald | |
dc.date.accessioned | 2021-10-27T08:26:54Z | |
dc.date.available | 2021-10-27T08:26:54Z | |
dc.date.issued | 2019 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/32810 | |
dc.source | IIOimport | |
dc.title | Texture control for Cu hybrid bonding pads using a PVD Cu process | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | De Messemaeker, Joke | |
dc.contributor.imecauthor | Jourdan, Nicolas | |
dc.contributor.imecauthor | Nolmans, Philip | |
dc.contributor.imecauthor | Kim, Soon-Wook | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.source.peerreview | yes | |
dc.source.beginpage | 425 | |
dc.source.endpage | 426 | |
dc.source.conference | Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials - SSDM | |
dc.source.conferencedate | 2/09/2019 | |
dc.source.conferencelocation | Nagoya Japan | |
imec.availability | Published - imec | |