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Texture control for Cu hybrid bonding pads using a PVD Cu process

dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorNolmans, Philip
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-27T08:26:54Z
dc.date.available2021-10-27T08:26:54Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32810
dc.sourceIIOimport
dc.titleTexture control for Cu hybrid bonding pads using a PVD Cu process
dc.typeProceedings paper
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorBeyer, Gerald
dc.source.peerreviewyes
dc.source.beginpage425
dc.source.endpage426
dc.source.conferenceExtended Abstracts of the 2019 International Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate2/09/2019
dc.source.conferencelocationNagoya Japan
imec.availabilityPublished - imec


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