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Electromigration behavior of 2μm sub-micron Cu/SiCN hybrid bonds

dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorStucchi, Michele
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-27T08:27:11Z
dc.date.available2021-10-27T08:27:11Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32811
dc.sourceIIOimport
dc.titleElectromigration behavior of 2μm sub-micron Cu/SiCN hybrid bonds
dc.typeProceedings paper
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Messemaeker, Joke::0000-0002-4872-0176
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage8.4
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019)
dc.source.conferencedate3/06/2019
dc.source.conferencelocationBrussels Belgium
dc.identifier.urlhttps://iitc-conference.org/2019-iitc-mam-program/
imec.availabilityPublished - imec


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