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GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces

dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorKhaled, Ahmad
dc.contributor.authorFranquet, Alexis
dc.contributor.authorSpampinato, Valentina
dc.contributor.authorConard, Thierry
dc.contributor.authorBrand, Sebastian
dc.contributor.authorKögel, Michael
dc.contributor.authorWiesler, Ingo
dc.date.accessioned2021-10-27T08:36:32Z
dc.date.available2021-10-27T08:36:32Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32846
dc.sourceIIOimport
dc.titleGHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorKhaled, Ahmad
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorSpampinato, Valentina
dc.contributor.imecauthorConard, Thierry
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecKhaled, Ahmad::0000-0003-2892-3176
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecSpampinato, Valentina::0000-0003-3225-6740
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.source.peerreviewyes
dc.source.conference45th International Symposium for Testing and Failure Analysis (ISTFA)
dc.source.conferencedate10/11/2019
dc.source.conferencelocationPortland, OR USA
imec.availabilityPublished - imec


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