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Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling

dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBeyne, Eric
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDe Preter, Inge
dc.contributor.authorDuval, Fabrice
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorGerets, Carine
dc.contributor.authorHeyvaert, Cindy
dc.contributor.authorBeirnaert, Filip
dc.contributor.authorCochet, Tom
dc.contributor.authorBex, Pieter
dc.contributor.authorHou, Lin
dc.contributor.authorLofrano, Melina
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorHeylen, Nancy
dc.contributor.authorSuhard, Samuel
dc.contributor.authorHonore, Mia
dc.contributor.authorWebers, Tomas
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-27T08:43:59Z
dc.date.available2021-10-27T08:43:59Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32872
dc.sourceIIOimport
dc.titleNovell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling
dc.typeProceedings paper
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorHeyvaert, Cindy
dc.contributor.imecauthorBeirnaert, Filip
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.source.peerreviewyes
dc.source.conference22nd European Microelectronics and Packaging Conference (EMPC)
dc.source.conferencedate16/09/2019
dc.source.conferencelocationPisa Italy
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8951856
imec.availabilityPublished - imec


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