Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling

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Authors
Derakhshandeh, Jaber; Beyne, Eric; Capuz, Giovanni; Inoue, Fumihiro; Cherman, Vladimir; De Preter, Inge; Duval, Fabrice; Slabbekoorn, John; Gerets, Carine; Heyvaert, Cindy; Beirnaert, Filip; Cochet, Tom; Bex, Pieter; Hou, Lin; Lofrano, Melina; Jamieson, Geraldine; Heylen, Nancy; Suhard, Samuel; Honore, Mia; Webers, Tomas; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald
Conference
22nd European Microelectronics and Packaging Conference (EMPC)
Title
Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling
Publication type
Proceedings paper
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