Browsing by author "Beirnaert, Filip"

Now showing items 1-3 of 3

Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling

Derakhshandeh, Jaber; Beyne, Eric; Capuz, Giovanni; Inoue, Fumihiro; Cherman, Vladimir; De Preter, Inge; Duval, Fabrice; Slabbekoorn, John; Gerets, Carine; Heyvaert, Cindy; Beirnaert, Filip; Cochet, Tom; Bex, Pieter; Hou, Lin; Lofrano, Melina; Jamieson, Geraldine; Heylen, Nancy; Suhard, Samuel; Honore, Mia; Webers, Tomas; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald (2019)
Scaling the 3D bumps pitch from 20 to 10 μm, focusing on the wet Cu seed etch process development

Suhard, Samuel; Moussa, Alain; Slabbekoorn, John; Beirnaert, Filip; De Preter, Inge; Holsteyns, Frank (2014)
Small pitch, high aspect ratio via-last TSV module

Van Huylenbroeck, Stefaan; Stucchi, Michele; Li, Yunlong; Slabbekoorn, John; Tutunjyan, Nina; Sardo, Stefano; Jourdan, Nicolas; Bogaerts, Lieve; Beirnaert, Filip; Beyer, Gerald; Beyne, Eric (2016)