Browsing by author "De Preter, Inge"
Now showing items 1-20 of 35
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10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020) -
3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers
Buisson, Thibault; De Preter, Inge; Suhard, Samuel; Vandersmissen, Kevin; Jaenen, Patrick; Witters, Thomas; Jamieson, Geraldine; Jourdain, Anne; Van Huylenbroeck, Stefaan; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012) -
3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
De Preter, Inge; Derakhshandeh, Jaber; Nagano, Fuya; Houshmand Sharifi, Shamin; Hou, Lin; Bex, Pieter; Suhard, Samuel; Shibata, Toshiaki; Yukinori, Oda; Hashimoto, Shigeo; Lieten, Ruben; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
3D stacking of Co and Ni based microbumps
De Preter, Inge; Derakhshandeh, Jaber; Hou, Lin; Gerets, Carine; Wang, Teng; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021) -
Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications
Vakanas, George; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Snyder, Brad; Van Campenhout, Joris; Croes, Kristof; Rebibis, Kenneth June; Beyne, Eric (2014) -
Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vandecasteele, Bjorn; Vanstreels, Kris; De Messemaeker, Joke; De Preter, Inge; Derakhshandeh, Jaber; Guerrieri, Stefano; Rebibis, Kenneth June; La Manna, Antonio; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2014) -
Cobalt UBM for fine pitch microbump applications in 3DIC
Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Dictus, Dries; Di Piazza, Luca; Hou, Lin; Guerrieri, Stefano; Vakanas, George; Armini, Silvia; Daily, Robert; Lesniewska, Alicja; Vandelaer, Yannick; Van De Peer, Myriam; Slabbekoorn, John; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking
Houshmand Sharifi, Shamin; Derakhshandeh, Jaber; Armini, Silvia; De Preter, Inge; Bex, Pieter; Hou, Lin; Bartha, Johan W; Neumann, Volker; Herregods, Sebastiaan; Nagano, Fuya; Rebibis, Kenneth June; Miller, Andy; De Wolf, Ingrid; Beyer, Gerald; Beyne, Eric (2017) -
Confined IMCs for low temperature and high throughput D2W bonding
Derakhshandeh, Jaber; La Tulipe, Douglas Charles; Capuz, Giovanni; Cherman, Vladimir; Gerets, Carine; Cochet, Tom; Shafahian, Ehsan; De Preter, Inge; Jamieson, Geraldine; Webers, Tomas; Beyne, Eric; Beyer, Gerald; Miller, Andy (2022) -
Die to wafer 3D stacking for below 10μm pitch microbumps
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy (2016) -
ELD NiB for microbumps passivation and wirebonding
Derakhshandeh, Jaber; De Preter, Inge; El-Mekki, Zaid; Hou, Lin; Gerets, Carine; Dictus, Dries; Vanstreels, Kris; Croes, Kristof; Miller, Andy; Beyer, Gerald; Beyne, Eric (2020) -
Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vanstreels, Kris; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Rebibis, Kenneth June; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2015) -
Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn
Nagano, Fuya; Kajihara, Masanori; Derakhshandeh, Jaber; Hou, Lin; Van De Peer, Myriam; De Preter, Inge; Houshmand Sharifi, Shamin; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Beyer, Gerald (2017) -
Impact of ELD layers in mechanical properties of microbumps for 3D stacking
Hou, Lin; Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; De Wolf, Ingrid (2016) -
Impact of NiB and Cu ELD layers on surface morphology and IMC growth rate of CoSn CuSn and NiSn systems
De Preter, Inge; Derakhshandeh, Jaber; Vandersmissen, Kevin; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatings
De Preter, Inge; Derakhshandeh, Jaber; Bex, Pieter; Fodor, Ferenc; Cherman, Vladimir; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
Integrated magnetic cores in FOWLP and their applications
Sun, Xiao; Slabbekoorn, John; Velenis, Dimitrios; Bex, Pieter; Duval, Fabrice; Sterken, Tom; Talmelli, Giacomo; de Preter, Inge; Webers, Tomas; Adelmann, Christoph; Miller, Andy; Van der Plas, Geert; Beyne, Eric (2020) -
Investigation of Co thin film as buffer layer applied to Cu/Sn eutectic bonding and UBM with Sn, SnCu, and SAC solders joints
Tang, Ya-Sheng; Derakhshandeh, Jaber; Kho, Yi-Tung; Chang, Yao-Jen; Slabbekoorn, John; De Preter, Inge; Vanstreels, Kris; Rebibis, Kenneth June; Beyne, Eric; Chen, Kuan-Neng (2017)