Browsing by author "De Preter, Inge"
Now showing items 21-35 of 35
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Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
Derakhshandeh, Jaber; Beyne, Eric; Beyer, Gerald; Capuz, Giovanni; Cherman, Vladimir; De Preter, Inge; Gerets, Carine; Shafahian, Ehsan; Kennes, Koen; Jamieson, Geraldine; Cochet, Tom; Webers, Tomas; Tobback, Bert; Van der Plas, Geert; La Tulipe, Douglas Charles; Phommahaxay, Alain; Miller, Andy (2022) -
Morphology of IMC in the binary systems of Co/Sn and Cu/Sn
Nagano, Fuya; Derakhshandeh, Jaber; Hou, Lin; Van De Peer, Myriam; De Preter, Inge; Houshmand Sharifi, Shamin; Kajihara, Masanori; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
New approach to investigate wettability and stability of capping layers on UBMs for 3D stacking applications
Hou, Lin; Derakhshandeh, Jaber; Bex, Pieter; Capuz, Giovanni; Van De Peer, Myriam; Wang, Teng; Houshmand Sharifi, Shamin; De Preter, Inge; Rebibis, Kenneth June; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid (2017) -
Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling
Derakhshandeh, Jaber; Beyne, Eric; Capuz, Giovanni; Inoue, Fumihiro; Cherman, Vladimir; De Preter, Inge; Duval, Fabrice; Slabbekoorn, John; Gerets, Carine; Heyvaert, Cindy; Beirnaert, Filip; Cochet, Tom; Bex, Pieter; Hou, Lin; Lofrano, Melina; Jamieson, Geraldine; Heylen, Nancy; Suhard, Samuel; Honore, Mia; Webers, Tomas; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald (2019) -
Process technology for the fabrication of a chip-in-wire style packaging
Vanden Bulcke, Mathieu; Iker, Francois; De Preter, Inge; Muller, Philippe; Soussan, Philippe; Beyne, Eric; Van Hoof, Chris; Baert, Kris (2008-05) -
Reflow process optimization for micro-bumps applications in 3D technology
Derakhshandeh, Jaber; De Preter, Inge; England, Luke; Schmid, Daniel; Slabbekoorn, John; Vakanas, George; Wang, Teng; Beyer, Gerald; Beyne, Eric; Marinissen, Erik Jan; Rebibis, Kenneth June; Lerch, Wilfried; Miller, Andy (2014) -
SAMs (self-assembled monolayers) passivation of Cobalt microbumps for 3D applications
Hou, Lin; Derakhshandeh, Jaber; Armini, Silvia; Gerets, Carine; De Preter, Inge; Rebibis, Kenneth June; Miller, Andy; De Wolf, Ingrid; Beyne, Eric (2015) -
Scaling the 3D bumps pitch from 20 to 10 μm, focusing on the wet Cu seed etch process development
Suhard, Samuel; Moussa, Alain; Slabbekoorn, John; Beirnaert, Filip; De Preter, Inge; Holsteyns, Frank (2014) -
Silicone for flexible packaging of thin dies (<20 μm) using wafer level techniques
Iker, Francois; De Preter, Inge; Gonzalez, Mario; Soussan, Philippe (2008) -
Study morphology and growth rate of intermetallic compound (IMC) for 3D stacking of fine pitch microbumps
De Preter, Inge; Derakhshandeh, Jaber; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications
De Preter, Inge; Derakhshandeh, Jaber; Heylen, Nancy; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Thiol based self-assenbled monolayers (SAMs) as an alternative surface finish for 3D Cu microbumps
Armini, Silvia; Vandelaer, Yannick; Lesniewska, Alicja; Cherman, Vladimir; De Preter, Inge; Inoue, Fumihiro; Derakhshandeh, Jaber; Vakanas, George; Beyne, Eric (2015) -
UBM and solder metallurgy selection for fine pitch 3D stacking
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Ultra thin chip embedding technology (UTCS-UTCP)
Beyne, Eric; Christiaens, Wim; Torfs, Tom; Huwel, W.; Perdu, Wim; Vanfleteren, Jan; Iker, Francois; Funaya, Takuo; Buisson, Thibault; De Preter, Inge; Jamieson, Geraldine; Soussan, Philippe; Van Hoof, Chris (2010) -
Ultra thin die embedding technology with 20um-pitch interconnection
Funaya, Takuo; Buisson, Thibault; De Preter, Inge; Beyne, Eric; Iker, Francois (2010)