Publication:

UBM and solder metallurgy selection for fine pitch 3D stacking

Date

2019
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Author(s)

Derakhshandeh, Jaber  
;
Hou, Lin  
;
De Preter, Inge  
;
Gerets, Carine  
;
Rebibis, Kenneth June  
;
Miller, Andy  
;
Beyer, Gerald  
;
Beyne, Eric  

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