Publication:

UBM and solder metallurgy selection for fine pitch 3D stacking

Date

2019
Meeting abstract
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dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorHou, Lin
dc.contributor.authorDe Preter, Inge
dc.contributor.authorGerets, Carine
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T08:44:18Z
dc.date.available2021-10-27T08:44:18Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32873
dc.identifier.urlhttps://iitc-conference.org/2019-iitc-mam-program/
dc.source.beginpage4.34
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019)
dc.source.conferencedate3/06/2019
dc.source.conferencelocationBrussels Belgium
dc.title

UBM and solder metallurgy selection for fine pitch 3D stacking

dc.typeMeeting abstract
dspace.entity.typePublication
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