Browsing by author "Honore, Mia"
Now showing items 1-12 of 12
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An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking
Hou, Lin; Derakhshandeh, Jaber; Radisic, Alex; Honore, Mia; De Coster, Jeroen; Cherman, Vladimir; Bex, Pieter; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Rebibis, Kenneth June (2018) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Philipsen, Harold; El-Mekki, Zaid; Honore, Mia; Rodet, Simon; Armini, Silvia; Drijbooms, Chris; Bender, Hugo; Ruythooren, Wouter (2011) -
Electrodeposition for 3D integration
Philipsen, Harold; Radisic, Alex; Luhn, Ole; Civale, Yann; Vandersmissen, Kevin; Rodet, Simon; Honore, Mia; Leunissen, Peter (2010) -
Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
El-Mekki, Zaid; Philipsen, Harold; Honore, Mia; Radisic, Alex; Slabbekoorn, John; Arnold, Marco; Fluegel, Alexander; Shu-Ya Chang, Iris; Struyf, Herbert; Mayer, Dieter (2016) -
Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
El-Mekki, Zaid; Radisic, Alex; Philipsen, Harold; Honore, Mia; Slabbekoorn, John; Struyf, Herbert; Arnold, Marco; Fluegel, Alexander; Mayer, Dieter; Shu-Ya Chang, Iris (2017) -
Height uniformity of micro-bumps electroplated on thin Cu seed layers
Yang, Liu; Slabbekoorn, John; Honore, Mia; Stiers, Karen; Struyf, Herbert; Vereecken, Philippe; Radisic, Alex (2016) -
Height uniformity of micro-bumps electroplated on thin Cu seed layers
Yang, Liu; Slabbekoorn, John; Honore, Mia; Stiers, Karen; Struyf, Herbert; Vereecken, Philippe; Radisic, Alex (2016) -
Metallization for 3D interconnect processing
Philipsen, Harold; Civale, Yann; Vandersmissen, Kevin; Honore, Mia; Inoue, Fumihiro; Leunissen, Peter (2012) -
Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling
Derakhshandeh, Jaber; Beyne, Eric; Capuz, Giovanni; Inoue, Fumihiro; Cherman, Vladimir; De Preter, Inge; Duval, Fabrice; Slabbekoorn, John; Gerets, Carine; Heyvaert, Cindy; Beirnaert, Filip; Cochet, Tom; Bex, Pieter; Hou, Lin; Lofrano, Melina; Jamieson, Geraldine; Heylen, Nancy; Suhard, Samuel; Honore, Mia; Webers, Tomas; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald (2019) -
TSV Cu plating and implications for CMP
Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Y.S.; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2011) -
TSV Cu plating and implications for CMP
Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Yu-Shuen; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2010) -
Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
Armini, Silvia; El-Mekki, Zaid; Vandersmissen, Kevin; Philipsen, Harold; Rodet, Simon; Honore, Mia; Radisic, Alex; Civale, Yann; Beyne, Eric; Leunissen, Peter (2011)