Browsing by author "Derakhshandeh, Jaber"
Now showing items 1-20 of 60
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10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020) -
3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
De Preter, Inge; Derakhshandeh, Jaber; Nagano, Fuya; Houshmand Sharifi, Shamin; Hou, Lin; Bex, Pieter; Suhard, Samuel; Shibata, Toshiaki; Yukinori, Oda; Hashimoto, Shigeo; Lieten, Ruben; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
3D stacking of Co and Ni based microbumps
De Preter, Inge; Derakhshandeh, Jaber; Hou, Lin; Gerets, Carine; Wang, Teng; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks
Hou, Lin; Derakhshandeh, Jaber; De Coster, Jeroen; Wang, Teng; Cherman, Vladimir; Bex, Pieter; Van De Plas, Geert; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid (2017) -
A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking
Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Lofrano, Melina; Beyne, Eric; Miller, Andy; Beyer, Gerald; De Wolf, Ingrid (2020) -
A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking
Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Beyne, Eric; De Wolf, Ingrid (2020) -
A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly
Capuz, Giovanni; Lofrano, Melina; Gerets, Carine; Duval, Fabrice; Bex, Pieter; Derakhshandeh, Jaber; Phommahaxay, Alain; Beyne, Eric; Miller, Andy; Vanstreels, Kris (2020) -
A novel resistance measurement methodology for in-situ UBM/Solder interfacial reaction monitoring
Hou, Lin; Derakhshandeh, Jaber; Beyne, Eric; De Wolf, Ingrid (2020) -
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021) -
An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking
Hou, Lin; Derakhshandeh, Jaber; Radisic, Alex; Honore, Mia; De Coster, Jeroen; Cherman, Vladimir; Bex, Pieter; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Rebibis, Kenneth June (2018) -
An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem
Noda, Hiroto; Hiro, Akito; Nishiguchi, Naoki; Derakhshandeh, Jaber; Slabbekoorn, John; Beyne, Eric (2023) -
Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications
Vakanas, George; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Snyder, Brad; Van Campenhout, Joris; Croes, Kristof; Rebibis, Kenneth June; Beyne, Eric (2014) -
Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vandecasteele, Bjorn; Vanstreels, Kris; De Messemaeker, Joke; De Preter, Inge; Derakhshandeh, Jaber; Guerrieri, Stefano; Rebibis, Kenneth June; La Manna, Antonio; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2014) -
Cobalt UBM for fine pitch microbump applications in 3DIC
Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Dictus, Dries; Di Piazza, Luca; Hou, Lin; Guerrieri, Stefano; Vakanas, George; Armini, Silvia; Daily, Robert; Lesniewska, Alicja; Vandelaer, Yannick; Van De Peer, Myriam; Slabbekoorn, John; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
Inoue, Fumihiro; Derakhshandeh, Jaber; Gerets, Carine; Beyne, Eric (2021) -
Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking
Houshmand Sharifi, Shamin; Derakhshandeh, Jaber; Armini, Silvia; De Preter, Inge; Bex, Pieter; Hou, Lin; Bartha, Johan W; Neumann, Volker; Herregods, Sebastiaan; Nagano, Fuya; Rebibis, Kenneth June; Miller, Andy; De Wolf, Ingrid; Beyer, Gerald; Beyne, Eric (2017) -
Confined IMCs for low temperature and high throughput D2W bonding
Derakhshandeh, Jaber; La Tulipe, Douglas Charles; Capuz, Giovanni; Cherman, Vladimir; Gerets, Carine; Cochet, Tom; Shafahian, Ehsan; De Preter, Inge; Jamieson, Geraldine; Webers, Tomas; Beyne, Eric; Beyer, Gerald; Miller, Andy (2022) -
Cu-Cu insertion bonding technique using photosensitive polymer as WLUF
Potoms, Goedele; Wang, Teng; Derakhshandeh, Jaber; Daily, Robert; Capuz, Giovanni; Gonzalez, Mario; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2014) -
Developing TSV wet cleaning chemistry for quantum computing application
Le Tulzo, Harold; Celeste, Loriana; Tendero, Ines; Derakhshandeh, Jaber; Gerets, Carine; Thomas, Candice; Charbonnier, Jean; Deschaseaux, Edouard; Lazerand, Thierry; Daviot, Jerome (2023)